From the first day of
establishment, AMPOC has always been actively playing the role as a communication bridge in the industry of information technology. AMPOC serves the clients from many industries such as PCB, Computer Systems and Communications, Semiconductor (from wafer manufacturing to PKG testing), FPD (precise testing solution for inspection and analysis), MEMS, precision surface treatment. AMPOC is the only supplier which distributes both equipment and materials to clients in Taiwan. AMPOC not only offers integrated and fine technical supports, it also conducts joint development with clients and continually pursues the balance between high-tech and eco-friendly solution. To offer better service to every client, AMPOC also sets up offices in the US, Hong Kong, Shanghai and Guangdong in China.

IC packaging

IC Packaging is a Semiconductor Manufacturing Process after wafer fabrication.

 

The followings are purposes of IC Packaging:

 

• Electrical connections – Signals and electric power

• Aids heat dissipation – Increased heat convection

• Physical and environmental protection for IC – Against breakage, corrosion, or moisture.

 

IC packaging processes:

 

Cut through the wafer to unit (die) and mount on the L/F with epoxy. Connect L/F to die pad and mold after forming.

 

• Dicing – Cut the wafer with saw machine.

• Bonding – Connect the inner L/F to die pad. Wire bonding is one of the processes which connect with Gold or Cupper wires.

• Mold and testing

 

Our resolutions:

Sn Plating chemicals

Sn-Pb Plating chemicals

Sn-Bi Plating chemicals

Immersion Tin chemicals

EDPR

nickel aminosulfonate, nickel sulfaminate